? semiconductor components industries, llc, 2006 may, 2006 ? rev. 1 1 publication order number: uesd3.3st5g/d esd3.3st5g series esd protection diodes in ultra small sod?723 package the esd series is designed to protect voltage sensitive components from esd. excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to esd. because of its small size, it is suited for use in cellular phones, mp3 players, digital cameras and many other portable applications where board space comes at a premium. specification features: ? small body outline dimensions: 0.055 x 0.024 (1.40 mm x 0.60 mm) ? low body height: 0.020 (0.5 mm) ? stand?off voltage: 3.3 v ? 12 v ? low leakage ? response time is typically < 1 ns ? esd rating of class 3 (> 16 kv) per human body model ? iec61000?4?2 level 4 esd protection ? iec61000?4?4 level 4 eft protection ? these are pb?free devices mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic epoxy meets ul 94 v?0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol value unit iec 61000?4?2 (esd) air contact 30 30 kv iec 61000?4?4 (eft) 40 a esd voltage per human body model per machine model 16 400 kv v total power dissipation on fr?5 board (note 1) @ t a = 25 c ? p d 150 mw junction and storage temperature range t j , t stg ?55 to +150 c lead solder temperature ? maximum (10 second duration) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. fr?5 = 1.0 x 0.75 x 0.62 in. 12 pin 1. cathode 2. anode device package shipping ? ordering information esdxxst5g sod?723 (pb?free) 8000/tape & reel marking diagram see specific marking information in the device marking column of the table on page 2 of this data sheet. device marking information http://onsemi.com sod?723 case 509aa ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. xx = specific device code m = date code = pb?free package (note: microdot may be in either location) xx m
esd3.3st5g series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current i f forward current v f forward voltage @ i f p pk peak power dissipation c max. capacitance @v r = 0 and f = 1 mhz uni?directional tvs i pp i f v i i r i t v rwm v c v br v f electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) device* device marking v rwm (v) i r ( a) @ v rwm v br (v) @ i t (note 2) i t v c (v) @ max i pp ? i pp (a) ? p pk (w) ? c (pf) max max min ma max max max typ esd3.3st5g e0 3.3 2.5 5.0 1.0 10.9 10.4 113 80 esd5.0st5g e2 5.0 1.0 6.2 1.0 13.3 8.8 117 65 esd12st5g e3 12 1.0 13.5 1.0 23.7 5.4 128 30 *other voltages available upon request. ?surge current waveform per figure 1. 2. v br is measured with a pulse test current i t at an ambient temperature of 25 c. figure 1. 8 x 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s
esd3.3st5g series http://onsemi.com 3 typical characteristics ?55 +25 7.4 figure 2. typical breakdown voltage versus temperature temperature ( c) + 150 7.2 7.1 7.0 6.9 6.8 6.3 ?55 20 figure 3. typical leakage current versus temperature temperature ( c) +25 16 12 8 4 0 breakdown voltage (volts) (v z @ i z ) i r (na) 7.3 + 150 6.7 6.6 6.5 6.4 18 14 10 6 2 esdxxst5g esdxxst5g
esd3.3st5g series http://onsemi.com 4 package dimensions sod?723 case 509aa?01 issue o notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min nom max millimeters a 0.49 0.52 0.55 b 0.25 0.28 0.32 c 0.08 0.12 0.15 d 0.95 1.00 1.05 e 0.55 0.60 0.65 1.35 1.40 1.45 l 0.15 0.20 0.25 h e 0.019 0.020 0.022 0.0098 0.011 0.013 0.0032 0.0047 0.0059 0.037 0.039 0.041 0.022 0.024 0.026 0.053 0.055 0.057 0.006 0.0079 0.010 min nom max inches d e b c a l 2x ?y? ?x? 0.08 (0.0032) xy h e 0.45 0.0177 0.50 0.0197 1.1 0.043 mm inches scale 10:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 uesd3.3st5g/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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